“Samsung Electronics announced that it has begun mass producing the industry’s first 4-gigabyte (GB) DRAM package based on the second-generation High Bandwidth Memory (HBM2) interface, for use in high performance computing (HPC), advanced graphics and network systems, as well as enterprise servers. Samsung’s new HBM solution will offer unprecedented DRAM performance – more than seven times faster than the current DRAM performance limit, allowing faster responsiveness for high-end computing tasks including parallel computing, graphics rendering and machine learning.”