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“A new technique could enable a robot to manipulate squishy objects like pizza dough or soft materials like clothing. Imagine a pizza maker working with a ball of dough. She might use a spatula to lift the dough onto a …
“Inside The MagPi magazine #116 - Hidden Hacks for Raspberry Pi. We unearth the Rasperry Pi secrets every owner should know - Capture the night sky with astrophotography. Take incredible photos of starry skies with Raspberry Pi - The top 10 Raspberry Pi …
News Toshiba Releases 150V N-channel Power MOSFET that Uses Latest Generation Process to Improve Power Supply Efficiency
“Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has launched a 150V N-channel power MOSFET “TPH9R00CQH” that uses the latest generation process, “U-MOSX-H,” and that is suitable for use in switching power supplies for industrial equipment—including those deployed in …
“Metallic materials used in engineering must be strong and ductile – capable of carrying high mechanical loads while able to withstand deformation without breaking. Whether a material is weak or strong, ductile or brittle, however, is not determined simply by the …
“A new technology could make rocket launches more successful When it comes to materials, engineers are always looking for something better. There is a constant need for stronger, lighter and easier-to-produce materials that can withstand harsh environments. This is particularly …
“MyBroadband successfully played Doom ported to a Raspberry Pi Pico using guidelines provided by Graham Sanderson, also known as Kilograham. The Raspberry Pi Pico is a microcontroller with a dual-core ARM Cortex-M0+ processor, 264KB of RAM, and 2MB of flash …
“MIT, RPI, and SUNY convene a national conversation on semiconductor tech translation and hard-tech startups. A growing gap in the transition of inventions from research labs to market is slowing the development and scale-up of new hardware technologies in the …
News 3rd Gen AMD EPYC Processors with AMD 3D V-Cache Technology Deliver Outstanding Leadership Performance in Technical Computing Workloads
“AMD (NASDAQ: AMD) announced the general availability of the world’s first data center CPU using 3D die stacking, the 3rd Gen AMD EPYC™ processors with AMD 3D V-Cache™ technology, formerly codenamed “Milan-X.” Built on the “Zen 3” core architecture …
“A custom pc based on 8085 with custom assembler and EEPROM programmer. This project consist of an assembler project written in Python in order to translate the assembly code into machine code recognizable from the 8085 microprocessor, acustom EEPROM writer …
“Today, Intel contributed the Scalable I/O Virtualization (SIOV) specification to the Open Compute Project (OCP) with Microsoft, enabling device and platform manufacturers access to an industry standard specification for hyperscale virtualization of PCI Express and Compute Express Link devices …