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“STMicroelectronics’ ALED6000 single-chip automotive LED driver with integrated DC/DC converter is a low-BoM (Bill of Materials) solution that allows design flexibility and keeps the lighting intensity consistent as electrical conditions within the vehicle fluctuate. Suitable for exterior lighting such …
“ON Semiconductor® (Nasdaq:ON), driving energy efficient innovations, announces industry’s first dedicated critical conduction mode (CrM) totem pole PFC controller as a new addition to their solution set for ultra-high density offline power supplies. In conventional PFC circuits, the …
News Maxim Integrated’s Essential Analog Supervisor Delivers Industry’s First Automotive Window Voltage Monitor with Built-In Self-Test for Advanced Driver Assistance Systems
“MAX16137 helps automotive system engineers achieve functional safety while reducing size by 50 percent Designers working to achieve automotive functional safety in Advanced Driver Assistance Systems (ADAS) can now reduce solution size and complexity with the MAX16137 single-window voltage monitor …
News Microchip Boosts Gallium Nitride (GaN) Radio Frequency (RF) Portfolio with Ka-band Monolithic Microwave Integrated Circuit (MMIC) with High Linearity for SatCom Terminals
“The GMICP2731-10 helps maintain signal fidelity by allowing Earth stations to transmit at high RF levels without sacrificing the quality of the signal Satellite communication systems use complex modulation schemes to achieve the blazingly fast data rates required to …
News New Family of 700V Buck Regulators From Renesas Offers Unmatched Feature Set for Home Appliances, Smart Homes, Sensing Systems, Power Meters and Industrial Controls
“Devices Offer Very Low Power Consumption, Excellent EMI, No Audible Noise, and Reduced BOM Costs; Complement Renesas’ MCU and Sensor Lines Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today unveiled a family of new 700V …
News Panasonic Commercializes a New Semiconductor Substrate Material Designed to Improve Reliability
“Panasonic Corporation announced today that its Industrial Solutions Company has commercialized a semiconductor package substrate material (Product No. R-1515V) enabling both low package warpage and high assembly-level reliability. The newly developed material has very low thermal expansion properties to reduce …
“Driving greater deployment efficiency in a compact form factor, Samsung’s new One Antenna Radio is built to accelerate 5G rollouts Samsung Electronics today unveiled a new radio designed to help mobile operators overcome the challenges they face in deploying …
News STMicroelectronics Extends STM32G0 Microcontroller Series with USB-C Full Speed Dual Role Port, CAN FD, and Larger Memory
“STMicroelectronics has expanded the STM32G0* Arm® Cortex®-M0+ microcontroller (MCU) series with more product variants and features such as dual-bank Flash, support for CAN FD and crystal-less USB Full-Speed data/host support. For budget-conscious applications, the new STM32G050 Value Line …
News Toshiba’s New Device Structure Improves SiC MOSFET High Temperature Reliability and Reduces Power Loss
“Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has developed a new SiC MOSFET device structure that simultaneously achieves higher reliability at high temperatures and lower power loss. In a 3300V chip at 175ºC, a level of current over double that of …
“When you call an Uber, send your friends a snapshot of your location, or use your phone to navigate to a nearby restaurant, what you may not realize is that the signal you’re using is actually provided to you …