Content for Hardware

Microchip Releases Demonstration Platform Based on Industry’s Lowest Power BLE Sensor Node for IoT Applications

“Microchip Technology Inc. (NASDAQ: MCHP), a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today released a demonstration platform for the world’s lowest-power Bluetooth Low Energy (BLE) sensor node. The platform comes complete with the award-winning ultra-low-power …

New movie screen allows for glasses-free 3-D at a larger scale

“3-D movies immerse us in new worlds and allow us to see places and things in ways that we otherwise couldn’t. But behind every 3-D experience is something that is uniformly despised: those goofy glasses. Fortunately, there may be …

Toshiba Starts World’s First Sample Shipment of 64-Layer 3D Flash Memory

“Toshiba Corporation (TOKYO: 6502) today unveiled the latest generation of its BiCS FLASHTM three-dimensional (3D) flash memory with a stacked cell structure1, a 64-layer device that will be first2 in the world to start sample shipments today. The …

ARM, Symantec and others create IoT security protocol

“A consortium of tech firms including ARM and Symantec has announced the creation of a security protocol designed to protect Internet of Things (IoT) devices. The group, which also includes Intercede and Solacia, has created The Open Trust Protocol (OTrP …

Cypress Simplifies Embedded System Design with New Low-Pin-Count HyperRAM Memory

“Cypress Semiconductor Corp., a global leader in embedded system solutions, today announced sampling of a new high-speed, self-refresh Dynamic RAM (DRAM) based on Cypress’s low-pin-count HyperBus™ interface. The 64Mb HyperRAM™ serves as an expanded scratchpad memory for rendering of …

Japan Will Make Its Last-Ever VCR This Month

“Most of us stopped using video cassette recorders a very, very long time ago. By 2008, DVD had officially replaced VHS as the preferred home media format, and the glory days of the 1980s—when VHS and Betamax battled it …

LETI Develops 3D Network-on-Chip to Improve High-Performance Computing

“Leti, a CEA Tech institute, today announced it has developed a new on-chip communications system to improve high-performance computing (HPC) that is faster and more energy efficient than current solutions and is compatible with 3D architectures. Leti researchers, working in …

TI introduces the industry’s fastest isolated gate driver for high-voltage applications

” Texas Instruments (TI) (NASDAQ: TXN) today introduced the industry’s fastest 5.7-kVRMS isolated dual-channel gate driver, the first of a new gate driver family in TI’s isolation portfolio. The UCC21520’s flexible, universal compatibility enables its use as …

Allegro MicroSystems, LLC Announces New DMOS Microstepping Driver with Translator and Overcurrent Protection

“Allegro MicroSystems, LLC announces a new integrated bipolar stepper motor driver IC with built-in translator for easy operation. Allegro’s A5985 is designed to operate bipolar stepper motors from full-step up to 1/32 step modes that are selectable by …

Microsemi Announces Imaging/Video Solution Providing a Secure, Reliable, Low Power Device for Imaging Applications

“Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the availability of a new imaging/video solution for the development of low power and reliable video processing applications. The new …