“GLOBALFOUNDRIES today announced the availability of FX-7 TM, an application-specific integrated circuit (ASIC) offering built on the company’s 7nm FinFET process technology. FX-7 is an integrated design platform that combines leading-edge manufacturing process technology with a differentiated suite of intellectual property and 2.5D/3D packaging to deliver the industry’s most complete solution for data center, machine learning, automotive, wired communications, and 5G wireless applications. Building on the continued success of FX-14, with industry-leading 56G SerDes and a legacy of ASIC expertise, FX-7 provides a comprehensive suite of tailored interface IPs including High Speed SerDes (60G, 112G), differentiated memory solutions including low-voltage SRAM, high-performance embedded TCAM, integrated DACs/ADCs, ARM processors, and advanced packaging options such as 2.5D/3D. In addition, the FX-7 portfolio enables new design methodologies and complex ASIC solutions for lower power and high-performance applications targeting hyper-scale data centers, 5G networking, and machine and deep learning applications. Future extensions are planned to support solutions for automotive ADAS and imaging applications. “The explosion of data traffic and bandwidth in global networks is driving a new set of demands for our customers,” said Mike Cadigan, senior vice president of the ASIC Business Unit at GF. “By leveraging our most advanced 7LP FinFET process technology, the FX-7 offering continues to extend our leadership in serving our customers by delivering the most advanced lower power and high performance ASIC solutions for new market paradigms such as data centers, deep computing, and wireless networking.””