“SK Hynix Inc.(‘the Company’, www.skhynix.com) announced it will construct a new memory semiconductor FAB in Cheongju, Chungcheongbuk-do to meet increasing NAND Flash demand. This is a part of a mid/long-term investment plan that SK Hynix declared at M14 completion ceremony in August 2015. At that time, the Company said it could spend 46 trillion won to set up 3 new FABs in Icheon and Cheongju including the M14. The new FAB will be located in a Cheongju Technopolis site. SK Hynix starts a design within next month then begins construction of the shell and the cleanroom in August 2017 to be completed in June 2019 with total investment of 2.2 trillion won. Equipment installation into the FAB shall be decided considering market conditions as well as the Company’s migration plans. SK Hynix has been expanding its NAND Flash manufacturing FAB in Cheongju since the completion of which in 2008. Plus, it starts to utilize the upper floor of the M14 to manufacture 3D NAND Flash from next year. Nevertheless, in order to grow further, it is important to secure production facilities in advance to deal with NAND Flash market growth to be led by 3D NAND solutions. Additionally, considering it takes more than 2 years normally to build a semiconductor FAB, the Company has determined to build the additional FAB as a result.”
Related Content
Related Posts:
- AMD Expands Ryzen Embedded Processor Family for High-Performance Industrial Automation, Machine Vision and Edge Applications
- AMD Extends 3rd Gen EPYC CPU Lineup to Deliver New Levels of Value for Mainstream Applications
- Arm Extends Cortex-M Portfolio to Bring AI to the Smallest Endpoint Devices
- Brand-New Snapdragon 7-Series Mobile Platform Provides Remarkable Performance and Power Efficiency with First-in-Tier Features
- Intel Gaudi AI Accelerator Gains 2x Performance Leap on GPT-3 with FP8 Software
- Microchip Introduces Industry’s Most Complete Solution for 800G Active Electrical Cables (AECs) Used for Generative AI Networks
- Microchip Unveils New Standard of Enhanced Code Security With the PIC18-Q24 Family of MCUs
- Micron First to Enable Ecosystem Partners With the Fastest, Lowest Latency High-Capacity 128GB RDIMMs Using Monolithic 32Gb DRAM
- Nexperia’s first SiC MOSFETs raise the bar for safe, robust and reliable power switching in industrial applications
- Nordic completes world’s first silicon-to-cloud locationing solution using Wi-Fi, cellular IoT, and GNSS