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“Toshiba America Electronic Components, Inc. (TAEC), a committed technology leader, today announced the availability of the state-of-the-art BG3 series, its next generation single-package ball grid array (BGA) solid state drive (SSD) product line based on Toshiba’s latest 64-layer, 3-bit-per-cell …
“Toshiba Memory Corporation, the world leader in memory solutions, today announced that it has developed a prototype sample of 96-layer BiCS FLASH™ three-dimensional (3D) flash memory with a stacked structure1, with 3-bit-per-cell (triple-level cell, TLC) technology. Samples of the …
News Toshiba’s development of low-power multi-hop wireless network technology that can operate on battery power for 10 years
“Toshiba has developed low-power multi-hop wireless network technology that can operate on battery power for over 10 years and can collect over 99.999% of data from sensors deployed over a wide area through wireless relaying. This technology makes it …
“Toshiba Corporation (TOKYO: 6502) today unveiled the latest generation of its BiCS FLASHTM three-dimensional (3D) flash memory with a stacked cell structure1, a 64-layer device that will be first2 in the world to start sample shipments today. The …