Content for Hardware

Latest PIC32 Family Increases Performance While Reducing Power Consumption

“The latest PIC32 microcontroller family from Microchip Technology Inc. (NASDAQ: MCHP) expands Microchip’s eXtreme Low Power (XLP) technology to 32-bit PIC32MX products. The PIC32MX1/2 XLP offers current PIC32MX customers an easy migration path to achieve higher performance at …

ROHM and A*STAR’S IME to develop artificial intelligence Chip for predictive maintenance in smart factories

“ROHM Semiconductor, a leading semiconductor manufacturer, and ASTAR’s Institute of Microelectronics (IME), a world renowned research institute under the Agency for Science, Technology and Research (ASTAR) today announced the joint development of an artificial intelligence (AI) chip …

Samsung Begins Mass Production of First Exynos-branded IoT Solution, the Exynos i T200

“Samsung Electronics, a world leader in advanced semiconductor technology, today announced the start of mass production of its first Exynos-branded Internet of Things (IoT) solution, the Exynos i T200. Built on a low-power 28-nanometer (nm) High-K Metal Gate (HKMG) process …

AMD EPYC™ Datacenter Processor Launches with Record-Setting Performance, Optimized Platforms, and Global Server Ecosystem Support

“AMD, and a global ecosystem of server partners, today marked a new era in the datacenter with the launch of AMD EPYC™ 7000 series high-performance datacenter processors. AMD was joined by multiple customers and partners at the global launch event …

LENOVO Delivers the World’s Largest Next-Generation Intel-based Supercomputer at Barcelona Supercomputing Center

“Today, at International Supercomputing Conference (ISC2017), Lenovo (HKSE: 992) (ADR: LNVGY) announced that it has completed the delivery and implementation of the world’s largest, next-generation Intel-based Supercomputer at the Barcelona Supercomputing Center (BSC). The 11.1 petaFLOP[1] Supercomputer …

GLOBALFOUNDRIES on Track to Deliver Leading-Performance 7nm FinFET Technology

“GLOBALFOUNDRIES today announced the availability of its 7nm Leading-Performance (7LP) FinFET semiconductor technology, delivering a 40 percent generational performance boost to meet the needs of applications such as premium mobile processors, cloud servers and networking infrastructure. Design kits are available …

Microsemi Announces SoftConsole v5.1, the World’s First Freely Available Windows-Hosted Eclipse Integrated Development Environment Supporting RISC-V Open Instruction Set Architecture

“Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the release of its SoftConsole version 5.1, the world’s first available Windows-hosted Eclipse integrated development environment (IDE) for designs …

PCI-SIG Publishes PCI Express 4.0, Revision 0.9 Specification

“PCI-SIG Developers Conference 2017 - PCI-SIG®, the organization responsible for the widely adopted PCI Express® (PCIe®) industry-standard input/output (I/O) technology, today announced the release of the PCI Express 4.0, Revision 0.9 Specification, supporting 16GT/s …

Microchip Extends eXtreme Low Power PIC32MM Microcontroller Family

“New PIC32MM “GPM” microcontrollers (MCUs) are now available from Microchip Technology Inc. (NASDAQ: MCHP). The eXtreme Low Power (XLP) devices feature large memory in small packages, providing ample battery life for space-constrained applications. With the inclusion of several connectivity options …

Surface-Mount Intelligent Low-Power Modules from STMicroelectronics Save Space in Energy-Efficient Motor Drives

“STMicroelectronics has added five space-saving surface-mount intelligent power modules (IPM) to its SLLIMM™-nano family, giving the choice of IGBT or MOSFET outputs for in-motor or other space-constrained drives all the way from very low power ratings up to 100W …